Ultra-fast pulsed picosecond laser with high peak power, stable and reliable
Self-developed cutting process technology patent, excellent kerf quality, no surface damage
High dimensional accuracy, small chipping, low thermal impact, excellent processing quality
Automatic loading and unloading, inspection, sorting and lobe functions
Technical specifications | |
Cutting Laser | Picosecond 1064nm Laser |
Lobe Laser | CO2 |
Cutting Laser Power | 70W |
Lobe Laser Power | 55W |
Laser Life | >20000h |
Platform Speed | 1000mm/s |
Control System Software | Integrated vision, laser and motion |