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After-Sales Mail: lastop-service@la-ap.com
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WAFER
FABRICATION
IGBT Laser Annealing | LA
Application
Ion-activation for silicon IGBT
SiC Laser Annealing | LA
Application
SiC wafer Ohmic contact annealling
Laser Induced
Crystallization | LIC
Application
Laser crystallization of
amorphous materials and
in-situ dopant activation
Laser Induced
Epitaxial Growth | LIEG
Application
Laser-induced epitaxial growth and
void elimination of amorphous silicon in
ultra-small via with large aspect ratio
Ultra-shallow
dopant laser annealing | LA
Application
Ultra-shallow dopant laser
annealing for BSI-CCD wafer
Wafer Laser
Marking | WLM
Application
Si wafer, Bonded wafer,
SiC/Saphire wafer laser marking
Laser Debonding | LD
Application
Debonding of temporary bonded wafer
by laser,followed by separating, and cleaning,
for carrier substrate re-use and ultra-thin
wafer subsequent processing
PRODUCTS & APPLICATIONS
Wafer Fabrication Packaging & Testing Precision Electronics
Products
Service
About Us
Contact Us
  • ADD: No.66 Antaiqi Rd, Gaoxin District,Chengdu, Sichuan, PR China
  • Wafer Fabrication: 028-85222347
  • Packaging&Testing: 028-88556026
  • Precision Electronics: 0755-23699089
  • TEL: 028-88556028
  • After-Sales Phone: 028-88556025
  • After-Sales Mail: lastop-service@la-ap.com
  • Company Mail: lastop@la-ap.com
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Chengdu Laipu Technology co.,LTD蜀ICP备18037246号-1