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激光打标机的发展及趋势
激光器的应用与芯片切割工艺的现况
激光切割中的焦点位置检测方法研究
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ADD: No.66 Antaiqi Rd, Gaoxin District,Chengdu, Sichuan, PR China
TEL: 028-88556028
Mail: lastop@la-ap.com
Wafer Fabrication: 028-85222347
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Products & Applications
Wafer Fabrication
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Contact Us
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WAFER
FABRICATION
IGBT
Laser Annealing
| LA
Application
Ion-activation for silicon IGBT
SiC
Laser Annealing
| LA
Application
Ohmic contact preparation for SiC wafers
Laser Induced
Crystallization | LIC
Application
Laser crystallization
and in-situ dopant activation of
amorphous materials
Laser Induced
Epitaxial Growth | LIEG
Application
Laser-induced epitaxial growth and
void elimination of amorphous silicon in
ultra-small via with large aspect ratio
Ultra-shallow
dopant laser annealing | LA
Application
Ultra-shallow dopant laser
annealing for BSI-CCD wafer
Wafer Laser
Marking | WLM
Application
Si wafer, Bonded wafer,
SiC/Saphire wafer laser marking
Laser Debonding
| LD
Application
Debonding of temporary bonded wafer
by laser,followed by separating, and cleaning,
for carrier substrate re-use and ultra-thin
wafer subsequent processing
PRODUCTS & APPLICATIONS
Wafer Fabrication
Packaging & Testing
Precision Electronics