Very high peak power laser which meets various precision processing hard-brittle materials
Patented optical shaping technology for thin film applications (Min pore size of 50μm PE film up to 1.8μm)
Various drilling techniques which meet the needs of straight, tapered, and shaped holes
Self-developed software, free to set the process menu according to the process requirements
| Technical specifications | |
| Laser wavelength & type | 355nm Nanosecond Laser / 355nm Picosecond Laser |
| Laser Power | 15/30/50W |
| Min. hole diameter | 1.8μm @ 0.5mm PE film |
| Drilling efficiency | 20-100 holes/sec @ 50μm PE, 3-5 sec/hole @ 0.75m ferrite |
| Structure formation & automation | Gantry structure, provide manual and fully automatic loading and unloading options |
| Power requirements | 220V/50Hz/16A |
| Overall Power Consumption | <2000W |
