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Laser Assisted
Bonding Welding | LAB
Laser Assisted Bonding Welding | LAB
Advanced Package LaserAssisted
Bonding, Mini/Micro LED Laser
Mega Welding
Product Features
  • Higher weld strength

  • High uniformity laser beam shaping

  • Customized laser spot size

  • Real-time feedback system with pressure sensing and temperature

  • Process traceability

  • Customized laser process development for new applications

Technical specifications
Laser wavelength808nm/1064nm
Laser power500-4000W
Spot TypeLinear, rectangular, round custom flat top spot
Welding Temperature150-300℃, real-time feedback adjustment
Solder selectionSAP solder/alloy solder/solder paste solder