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Automatic Laser Cutting | LC
Automatic Laser Cutting | LC
Application
PCB/FPC/RF/Touch ID/Type-C/TF-Card
/LGA/BGA and other ty pes of modules,
circuit boards, packaging IC carrier
board precision cutting, slotting
Product Features
  • Select laser, fixture and stage according to actual product processing needs

  • One machine for drilling, cutting and scribing, reducing customer costs

  • Support full cutting / half cutting process

  • Single and double head, online, offline, automatic loading and unloading options, strong flexibility

  • Support multi-feature CCD visual positioning, with automatic compensation function

Technical specifications
Laser wavelength355nm, 532nm, 1064nm, etc.
Laser pulse widthNanosecond, picosecond, femtosecond
Laser powerUV30W Max, Green60W Max
Laser Life>20,000 hours
Product thickness≤2mm
Cutting Range350×400mm, can be customized
Processing speed800mm/s(Max.)
Platform AccuracyRepeat ≤1μm, positioning ≤3μm
Positioning accuracy±5μm