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PRECISION
ELECTRONICS
Laser Assisted
Bonding Welding | LAB
Application
Advanced Package Laser Assisted
Bonding, Mini/Micro LED
Laser Mega Welding
PCB X-OUT Laser
Marking | LM
Application
Automatic identification and laser marking
of scrap units after defect detection process
for semiconductor packaging boards and
electronic module boards
Automatic Substrate
Laser Marking | LM
Application
Fully automatic laser marking of
substrate products such as BGA/LGA/SIP
Ceramic Laser
Drilling/Dicing | LDR
Application
Precision drilling, cutting and
scribing of alumina/aluminium nitride/
zirconium oxide/silicon nitride，etc.
Glass Substrate
Laser Induced
Drilling | LDR
Application
Laser induced drilling through holes
and blind holes for special-shaped glass,
glass, RF components, optoelectronic
components, photomask plates, MEMS
components, glass based high-density
substrates, advanced wafer packaging,
glass spacer chips, Mini/Micro LED display
panel glass substrates, foldable screens, etc
Ultrafast Laser High
Speed Drilling | LDR
Application
Mainly used for rapid drilling of chip inductor
raw ceramics, TSV, TGV, HDI, advanced package
loading board, and other applications, as well
as various polymer films
Thin Film
Laser Drilling | LDR
Application
Various thin films fine processing (precision drilling
of PE films) and hard-brittle material substrates
drilling/ cutting (ferrite, sapphire, various
glasses, silicon wafers, various ceramics
and heat-sensitive polymers, etc.)
Automatic Laser
Cutting | LC
Application
PCB/FPC/RF/Touch ID/Type-C/TF-Card/LGA/BGA
and other types of modules, circuit boards,
packaging IC carrier board precision cutting, slotting
Glass Cutting &
Lobing | LC
Application
Cutting of full-screen glass, sapphire, digital 3D
front and back cover glass, various optical glass,
and filter glass
PCB Module
Laser Cutting | LC
Application
PCB/FPC/RF/TouchID/Type-C/TF-Card/LGA/BGA
and other types of modules, circuit boards,
packaging IC carrier board precision cutting
and post-cutting inspection etc.
Laser
Trimming | LR
Application
Used for LED, Mini LED direct display
module after plastic sealing defect
repair, circuit board industry line repair,
tin ball rework, etc.
Through the upstream mes system to
export Mapping map coordinates, visual
positioning of defective areas, laser
removal, for subsequent process repair
Dedicated laser
precision marking
equipment | LM
Application
Automatic laser labeling in the automotive
industry, cantilever laser marking in the auto
parts industry, laser engraving on calipers in
the gauging industry, large-format laser
marking in aviation and aerospace, automatic
marking in the PCB industry
PRODUCTS & APPLICATIONS
Wafer Fabrication Packaging & Testing Precision Electronics
Products
Service
About Us
Contact Us
  • ADD: No.66 Antaiqi Rd, Gaoxin District,Chengdu, Sichuan, PR China
  • Wafer Fabrication: 028-85222347
  • Packaging&Testing: 028-88556026
  • Precision Electronics: 0755-23699089
  • TEL: 028-88556028
  • After-Sales Phone: 028-88556025
  • After-Sales Mail: lastop-service@la-ap.com
  • Company Mail: lastop@la-ap.com
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Chengdu Laipu Technology co.,LTD蜀ICP备18037246号-1