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PCB X-OUT
Laser Marking | LM
PCB X-OUT Laser Marking | LM
Application
Automatic identification and laser
marking of scrap units after defect
detection process for semiconductor
packaging boards and electronic
module boards
Product Features
  • Automatic recognition of front-end process marks. Direct access to Mapping files for laser marking

  • Line scan CCD detection and identification system

  • Material number processing information storage and recording function

Technical specifications
Laser wavelength532nm
CCD positioning accuracy±5μm
Output power0-10W adjustable
Laser Marking Depth0.05-0.4mm adjustable
Line width30μm
Repeatability±3μm
CCD positioning5 megapixels
CCD video detection20 megapixels