Customized ultra-fast picosecond / femtosecond lasers with low thermal effects
Self-developed drilling process technology which meets different process requirements
Excellent hole formation quality, high real roundness and small taper
Support visual positioning of various features
| Technical specifications | |
| Laser power | 10-100W |
| Processing speed | 8000 holes/sec (hole diameter, hole spacing related) |
| Applicable material thickness | ≤0.5mm |
| Bore Accuracy | ±5% |
| Position accuracy | ±10μm |
| Stage travel | 300×300mm（customizable） |
| Automation configuration | Stacked cassette, four robots automatic loading and unloading |
