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Laser Debonding | LD
Laser Debonding | LD
Application
Debonding of temporary bonded
wafer by laser, followed by
separating, and cleaning, for
carrier substrate re-use and
ultra-thin wafer subsequent
processing
Product Features
  • Laser debonding, stripping and cleaning functions

  • Square top hat beam, benefits high debonding efficiency and low thermal damage

  • Real-time monitoring and  automatic compensation, ensuring process stability

  • Providing wavelength- matching bonding adhesive

ItemLD1120 / LD1140
Laser wavelength355nm/1340nm
Wafer size6 inch,  8 inch, 12 inch
Laser power15/30W@355nm, 100W@1340nm
Focused spot sizeX:0.2mm~1.0mm, Y:0.2mm~1.0mm
Laser energy density0.05-1J/cm2
Typical Laser Scan Time100 sec@12 inch