Laser debonding, stripping and cleaning functions
Square top hat beam, benefits high debonding efficiency and low thermal damage
Real-time monitoring and automatic compensation, ensuring process stability
Providing wavelength- matching bonding adhesive
Item | LD1120 / LD1140 |
Laser wavelength | 355nm/1340nm |
Wafer size | 6 inch, 8 inch, 12 inch |
Laser power | 15/30W@355nm, 100W@1340nm |
Focused spot size | X:0.2mm~1.0mm, Y:0.2mm~1.0mm |
Laser energy density | 0.05-1J/cm2 |
Typical Laser Scan Time | 100 sec@12 inch |