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SiC Laser Annealing | LA
SiC Laser Annealing | LA
Application
SiC wafer Ohmic contact annealling
Product Features
  • First domestic green laser machine for mass pruduction

  • High reliability and stability

  • Independly developped Optical system, LIET technology with IP

  • Green/UV laser two wavelengths are optional

ItemLA2515UVLA2540/2550S
Wafer Size6 inch,8 inch
Spot sizeX:100~500μmY:100~500μm
Max. laser energy densityGreen:10J/cm2UV:6J/cm2
Specific contact resistance~10-5Ω·cm2
Oxygen control≤10ppm