12-inch wafer mass production innovatio
Multi-laser high precision modulation technology
Large area rectangular top-hat beam, high productivity
High energy density control precision
| Laser Wavelength | 532nm |
| Wafer Size | 12 inch |
| Energy Density Accuracy | 5mJ/cm2 |
| Beam Of Uniformity | ≤1% |
| Focal Depth Range | 5mm |
| Process Effect | Crystallization and void elimination |
