High precision laser processing&depth control
Auto sample transfer, high precision positioning
Auto detection of marking effects
Multi-dust processing，Max. control of particle size
| Item | WLM1120 / WLM2120 / WLM2130 |
| Laser wavelength | 355/532nm |
| Laser power | 10W/15W@355nm, 15W/30W@532nm |
| Wafer Positioning Accuracy | ±0.1mm |
| Marking repeatability | ±20μm |
| Single point diameter | 45-80μm |
| roundness | >95% |
| Wafer size | 6 inch, 8 inch, 12 inch |
| Font | Standard SIMI font |
