High reliability and stability
Independently developed optical syste
Excellent thermal budget control
Handles ultra-thin Taiko wafers down to 50μm
| Wafer Size | 6-inch, 8-inch, 12-inch | |||
| Laser Power | 60W*2 | 90W*2 | 60W*2+300W | 90W*2+300W |
| Laser Energy Density | ≥5J/cm2×2 | |||
| Activation Efficiency | ≥95%@B+ | ≥90%@P+ | ||
| RS Non-Uniformity | WIW：≤1%@3sigma | WTW：≤1%@3sigma | ||
