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After-Sales Mail: lastop-service@la-ap.com
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PACKAGING &
TESTING
LOW-K Wafer
Laser Grooving | LG
Application
LOW-K wafer Laser Grooving and scribing
Wafer Laser Scribing /
Cutting | LS
Application
TAIKO ring cutting, Si/SiC wafer
cutting, Si/SiC wafer Back metal cutting
IC Framework Laser
Marking | CLM
Application
Packaging framework 2D code marking
Laser Debonding | LD
Application
Debonding of temporary bonded wafer
by laser,followed by separating, and cleaning,
for carrier substrate re-use and ultra-thin
wafer subsequent processing
Optical Inspection
system | OIS
Application
WB and DB inspection of SOT23/323/523,
SOD123/323/523/723/923, QFN/DFN,
SOP8/16/23, DIP, SSOP, TSSOP, etc.
Strip Laser
Marking | CLM
Application
DIP, SOP, TSSOP, BGA, QFN, DFN, QFP and other IC strip marking
TO-252 package strip markings
SOT89/SOT223/SOT23 SMD component strip marking
Automatic Laser
Deflashing | LDF
Application
All kinds of package moulding and pin deflashing
SOT89/SOT223 a class of high-pressure
water is hard to remove the overflow
Laser deflashing residue on the surface
of heat sink of various power devices
Fiber Laser High
Speed Marking | BLM
Application
In-line high-speed laser marking
of various discrete devices
Laser
Decapping | LDC
Application
Analysis of product failure in
Packaging & testing line and laboratories
PRODUCTS & APPLICATIONS
Wafer Fabrication Packaging & Testing Precision Electronics
Products
Service
About Us
Contact Us
  • ADD: No.179 Kangqiang 3th Rd, Gaoxin District,Chengdu, Sichuan, PR China
  • Wafer Fabrication: 028-85222347
  • Packaging&Testing: 028-88556026
  • Precision Electronics: 0755-23699089
  • TEL: 028-88556028
  • After-Sales Phone: 028-88556025
  • After-Sales Mail: lastop-service@la-ap.com
  • Company Mail: lastop@la-ap.com
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Chengdu LasTop Tech Co.,Ltd蜀ICP备18037246号-1