Customized picosecond/femtosecond laser. Laser flight pulse pointing, compatible with
single point/spin cut drilling process. Integrated superior software algorithms that automatic optimization laser pointing and
cutting paths and directions
Automatic detection of undrilled holes
| Technical specifications | |
| Laser | Ultra-fast picosecond / femtosecond laser |
| Processing Product Size | X/Y: 350×350mm 12" glass wafer |
| Glass thickness | 100-1500μm |
| Focused spot diameter | <3μm |
| UPH | ≥5000 holes/sec |
| Platform positioning accuracy | ≤±2μm |
| Repeat Positioning Accuracy | ≤±1μm |
| Vision configuration | 10 million pixels |
