Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency
Correction technology ensures high precision machining and consistency
Auto-positioning, auto-focusing, auto-detection, ensuring high yield rate
Support warpage/TAIKO wafer transfer
| Item | LS1520/LS1530 |
| Laser wavelength | 355nm |
| Laser output power | 15/30W |
| Processing method | Combined scanning and linear/rotary stage motion |
| Positioning accuracy | ±1μm |
| Processing accuracy | ±5μm |
| Wafer size | 6 inch, 8 inch, 12 inch |
| Chipping | <10μm |
