Laser debonding, stripping and cleaning functions
Square top hat beam, benefits high debonding efficiency and low thermal damage
Real-time monitoring and automatic compensation, ensuring process stability
Providing wavelength- matching bonding adhesive
| Item | LD1120 / LD1140 |
| Laser wavelength | 355nm/1340nm |
| Wafer size | 6 inch, 8 inch, 12 inch |
| Laser power | 15/30W@355nm, 100W@1340nm |
| Focused spot size | X:0.2mm~1.0mm, Y:0.2mm~1.0mm |
| Laser energy density | 0.05-1J/cm2 |
| Typical Laser Scan Time | 100 sec@12 inch |
