Automatic Laser Deflashing | LDF

Application

All kinds of package moulding and pin
deflashing
SOT89/SOT223 a class of high-pressure
water is hard to remove the overflow
Laser deflashing residue on the surface
of heat sink of various power devices

Product Features

Laser scanning and vaporization for deflashing. No chemical softening or high-pressure water jetting required
Optical shaping technology, ensuring no damage to tube pins.Improving removal efficiency
Dual quad laser head, front and back side laser deflashing synchronously, Increase production capacity.
Automatic loading and unloading,With intelligent identification, automatic flip and anti-reverse function

Technical specifications
Operating mode	Two-way four-head, synchronous work
Laser power	50W/100W×2/4
Undistortion scan area	300×150mm²
Laser vaporization depth	0.004-0.2mm adjustable
UPH	≥7500pcs/hr@SOT89
Max. loading volume at one time	300 strips
Repeat accuracy	±0.05mm

PRODUCTS & APPLICATIONS

Packaging & Testing

LOW-K Wafer Laser Grooving | LG IC framework Laser Marking | CLM Strip Laser Marking | CLM Fiber Laser High Speed Marking | BLM

Wafer Laser Scribing / Cutting | LS Optical detection system | OIS Automatic Laser Deflashing | LDF Laser Decapping | LDC

PRODUCTS & APPLICATIONS

Packaging & Testing